このエントリーをはてなブックマークに追加
ID 15408
JaLCDOI
Sort Key
1
FullText URL
Author
Sakakibara, Akira
Nakagawa, Keiyu
Kanadani, Teruto
Abstract
Effect of addition of a small amount of copper to Al- 12mass % Zn binary alloy on the process of low temperature aging is studied by hardness test and transmission electron microscopy. Age hardening rate after quenching from various temperatures is slowed down by addition of 0.5mass % copper to the binary alloy. The hardness obtained after long aging, however, is increased a little by the addition of copper. The extent of soft surface layer formed by aging in the copper-added alloy is nearly equal to that obtained in the binary alloy.
Publication Title
Memoirs of the Faculty of Engineering, Okayama University
Published Date
1995-03-27
Volume
volume29
Issue
issue2
Publisher
Faculty of Engineering, Okayama University
Publisher Alternative
岡山大学工学部
Start Page
1
End Page
4
ISSN
0475-0071
NCID
AA10699856
Content Type
Departmental Bulletin Paper
OAI-PMH Set
岡山大学
language
英語
File Version
publisher
NAID
Eprints Journal Name
mfe