| ID | 15408 |
| JaLCDOI | |
| Sort Key | 1
|
| FullText URL | |
| Author |
Sakakibara, Akira
Nakagawa, Keiyu
Kanadani, Teruto
|
| Abstract | Effect of addition of a small amount of copper to Al- 12mass % Zn binary alloy on the process of low temperature aging is studied by hardness test and transmission electron microscopy. Age hardening rate after quenching from various temperatures is slowed down by addition of 0.5mass % copper to the binary alloy. The hardness obtained after long aging, however, is increased a little by the addition of copper. The extent of soft surface layer formed by aging in the copper-added alloy is nearly
equal to that obtained in the binary alloy.
|
| Publication Title |
Memoirs of the Faculty of Engineering, Okayama University
|
| Published Date | 1995-03-27
|
| Volume | volume29
|
| Issue | issue2
|
| Publisher | Faculty of Engineering, Okayama University
|
| Publisher Alternative | 岡山大学工学部
|
| Start Page | 1
|
| End Page | 4
|
| ISSN | 0475-0071
|
| NCID | AA10699856
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| Content Type |
Departmental Bulletin Paper
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| OAI-PMH Set |
岡山大学
|
| language |
English
|
| File Version | publisher
|
| NAID | |
| Eprints Journal Name | mfe
|
