ID | 65945 |
FullText URL | |
Author |
Ikura, Ryohei
Department of Macromolecular Science, Graduate School of Science and Forefront Research Center for Fundamental Sciences, Osaka University
Kajimoto, Kota
Department of Macromolecular Science, Graduate School of Science, Osaka University
Park, Junsu
Department of Macromolecular Science, Graduate School of Science and Forefront Research Center for Fundamental Sciences, Osaka University
Murayama, Shunsuke
Graduate School of Organic Materials Engineering, Yamagata University
Fujiwara, Yusei
Department of Mechanical Engineering, Osaka Institute of Technology
Osaki, Motofumi
Department of Macromolecular Science, Graduate School of Science and Forefront Research Center for Fundamental Sciences, Osaka University
Suzuki, Tomohiro
Kanagawa Technical Center, Yushiro Chemical Industry Co., Ltd.
Shirakawa, Hidenori
Kanagawa Technical Center, Yushiro Chemical Industry Co., Ltd.
Kitamura, Yujiro
Kanagawa Technical Center, Yushiro Chemical Industry Co., Ltd.
Takahashi, Hiroaki
Kanagawa Technical Center, Yushiro Chemical Industry Co., Ltd.
Ohashi, Yasumasa
Kanagawa Technical Center, Yushiro Chemical Industry Co., Ltd.
Obata, Seiji
Research Core for Interdisciplinary Sciences, Okayama University
Harada, Akira
SANKEN (The Institute of Scientific and Industrial Research), Osaka University
Ikemoto, Yuka
Japan Synchrotron Radiation Research Institute
Nishina, Yuta
Research Core for Interdisciplinary Sciences, Okayama University
ORCID
Kaken ID
publons
researchmap
Uetsuji, Yasutomo
Department of Mechanical Engineering, Osaka Institute of Technology
Matsuba, Go
Graduate School of Organic Materials Engineering, Yamagata University
Takashima, Yoshinori
Department of Macromolecular Science, Graduate School of Science and Forefront Research Center for Fundamental Sciences, Osaka University
|
Abstract | Practical applications like very thin stress-strain sensors require high strength, stretchability, and conductivity, simultaneously. One of the approaches is improving the toughness of the stress-strain sensing materials. Polymeric materials with movable cross-links in which the polymer chain penetrates the cavity of cyclodextrin (CD) demonstrate enhanced strength and stretchability, simultaneously. We designed two approaches that utilize elastomer nanocomposites with movable cross-links and carbon filler (ketjenblack, KB). One approach is mixing SC (a single movable cross-network material), a linear polymer (poly(ethyl acrylate), PEA), and KB to obtain their composite. The electrical resistance increases proportionally with tensile strain, leading to the application of this composite as a stress- strain sensor. The responses of this material are stable for over 100 loading and unloading cycles. The other approach is a composite made with KB and a movable cross-network elastomer for knitting dissimilar polymers (KP), where movable cross-links connect the CD-modified polystyrene (PSCD) and PEA. The obtained composite acts as a highly sensitive stress-strain sensor that exhibits an exponential increase in resistance with increasing tensile strain due to the polymer dethreading from the CD rings. The designed preparations of highly repeatable or highly responsive stress-strain sensors with good mechanical properties can help broaden their application in electrical devices.
|
Keywords | stress-strain sensor
carbon composite
movable cross-link
supramolecular materials
polymericmaterials
tough materials
upcycling
|
Published Date | 2023-09-11
|
Publication Title |
ACS Polymers Au
|
Volume | volume3
|
Issue | issue5
|
Publisher | American Chemical Society
|
Start Page | 394
|
End Page | 405
|
ISSN | 2694-2453
|
Content Type |
Journal Article
|
language |
English
|
OAI-PMH Set |
岡山大学
|
Copyright Holders | © 2022 The Authors.
|
File Version | publisher
|
DOI | |
Web of Science KeyUT | |
Related Url | isVersionOf https://doi.org/10.1021/acspolymersau.3c00010
|
License | https://creativecommons.org/licenses/by-nc-nd/4.0/
|
Funder Name |
Ministry of Education, Culture, Sports, Science and Technology
Japan Science and Technology Agency
|
助成番号 | JP19H05714
JP19H05721
JP22H04548
JP19H05717
JPMJCR22L4
|