このエントリーをはてなブックマークに追加
ID 55636
フルテキストURL
著者
Ishikawa, Atsushi Department of Electrical and Electronic Engineering, Okayama University
Kato, Taiki Department of Electrical and Electronic Engineering, Okayama University
Takeyasu, Nobuyuki Department of Chemistry, Okayama University
Fujimori, Kazuhiro Department of Electrical and Electronic Engineering, Okayama University
Tsuruta, Kenji Department of Electrical and Electronic Engineering, Okayama University
抄録
A technique of selective electroless plating onto PLA-ABS (Polylactic Acid-Acrylonitrile Butadiene Styrene) composite structures fabricated by three-dimensional (3D) printing is demonstrated to construct 3D microwave metamaterials. The reducing activity of the PLA surface is selectively enhanced by the chemical modification involving Sn2+ in a simple wet process, thereby forming a highly conductive Ag-plated membrane only onto the PLA surface. The fabricated metamaterial composed of Ag-plated PLA and non-plated ABS parts is characterized experimentally and numerically to demonstrate the important bi-anisotropic microwave responses arising from the 3D nature of metallodielectric structures. Our approach based on a simple wet chemical process allows for the creation of highly complex 3D metal-insulator structures, thus paving the way toward the sophisticated microwave applications of the 3D printing technology. Published by AIP Publishing.
備考
This is an Accepted Manuscript of an article published by American Institute of Physics
発行日
2017-10-30
出版物タイトル
Applied Physics Letters
111巻
18号
出版者
American Institute of Physics
開始ページ
183102
ISSN
0003-6951
NCID
AA00543431
資料タイプ
学術雑誌論文
言語
English
OAI-PMH Set
岡山大学
著作権者
https://creativecommons.org/licenses/by-nc-nd/4.0/deed.ja
論文のバージョン
author
DOI
Web of Sience KeyUT
関連URL
isVersionOf https://doi.org/10.1063/1.4986203