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ID 14069
Eprint ID
14069
フルテキストURL
著者
Donghui, MA Graduate student, Graduate School of Natural Science and Technology, Okayama University
Torii, Tashiyuki Graduate School of Natural Science and Technology, Okayama University
Shimizu, Kenichi Graduate School of Natural Science and Technology, Okayama University
Matsuba, Akira Hiroshima Prefectural Technology Research Institute
抄録
As model specimens of surface film-bonded materials, pure copper films with a thickness of 100μm were bonded to the surface of steel base with epoxy resin, where the tensile residual stress was measured by an X-ray on the surface copper film. The distribution of initial electric resistance was measured on both copper film and base specimen by a direct current potential drop technique. As a result, there was a good agreement between the measured and theoretical values. From the fatigue testing results, it was shown that the measured electric resistance increased with the fatigue crack length on the copper film, which was almost equal to the theoretical value calculated for a central slit in a plate with finite width. This was probably because the fatigue crack was opened due to the tensile residual stress on the film even under unloading condition. In addition, the internal crack length during fatigue was examined by ultrasonic testing for the film-bonded specimen. As a result, there was a difference in the fatigue crack length between the surface copper film and the inner base.
発行日
2008-01
出版物タイトル
Memoirs of the Faculty of Engineering, Okayama University
42巻
1号
出版者
Faculty of Engineering, Okayama University
出版者(別表記)
岡山大学工学部
開始ページ
104
終了ページ
109
ISSN
0475-0071
NCID
AA10699856
資料タイプ
紀要論文
言語
English
論文のバージョン
publisher
査読
無し
Eprints Journal Name
mfe