Observation of Orientation Change During Plastic Deformation of Polycrystalline Copper by EBSD Method

Change in crystal orientation and strain of individual grains during tensile plastic deformation are studied to clarify on the microscopic deformation behavior of polycrystalline copper. The orientation of grain is measured by electron backscatter diffraction (EBSD) technique in the scanning electron microscope. The principal strain of grain is also measured by obtaining the approximated ellipse of strain distribution. The deformation of grains dependent on their initial orientation and the rotation of the principal strain during uniaxial tension are clarified.