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ID 62040
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Author
Watanabe, Kazunori Graduate School of Interdisciplinary Science and Engineering in Health Systems, Okayama University ORCID Kaken ID publons researchmap
Ohtsuki, Takashi Graduate School of Interdisciplinary Science and Engineering in Health Systems, Okayama University ORCID Kaken ID publons researchmap
Abstract
Stress resistance mechanisms include upregulation of heat shock proteins (HSPs) and formation of granules. Stress-induced granules are classified into stress granules and nuclear stress bodies (nSBs). The present study examined the involvement of nSB formation in thermal resistance. We used chemical compounds that inhibit heat shock transcription factor 1 (HSF1) and scaffold attachment factor B (SAFB) granule formation and determined their effect on granule formation and HSP expression in HeLa cells. We found that formation of HSF1 and SAFB granules was inhibited by 2,5-hexanediol. We also found that suppression of HSF1 and SAFB granule formation enhanced heat stress-induced apoptosis. In addition, the upregulation of HSP27 and HSP70 during heat stress recovery was suppressed by 2,5-hexanediol. Our results suggested that the formation of HSF1 and SAFB granules was likely to be involved in the upregulation of HSP27 and HSP70 during heat stress recovery. Thus, the formation of HSF1 and SAFB granules was involved in thermal resistance.
Keywords
heat shock response
nuclear stress bodies
HSF1 granules
SAFB granules
liquid-liquid phase separation
Published Date
2021-05-07
Publication Title
International Journal of Molecular Sciences
Volume
volume22
Issue
issue9
Publisher
MDPI
Start Page
4982
ISSN
1422-0067
Content Type
Journal Article
language
English
OAI-PMH Set
岡山大学
Copyright Holders
© 2021 by the authors.
File Version
publisher
PubMed ID
NAID
DOI
Web of Science KeyUT
Related Url
isVersionOf https://doi.org/10.3390/ijms22094982
License
https://creativecommons.org/licenses/by/4.0/
Funder Name
Naito Foundation, Japan Health and Research Institute
Japan Society for the Promotion of Science
助成番号
16H05925